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"GT target", A new high rate sputtering target of magnetic materials
Authors:Nakamura   K. Yamada   T. Ohta   Y. Itoh   A.
Affiliation:ULVAC Corporation, Chiba, Japan;
Abstract:A new type of a magnetic material target for high rate sputtering, "Gap Type target (GT target)" have been developed. GT target have many narrow gaps crossing the magnetic flux produced by permanent magnets attached to the cathode. Therefore, the magnetic flux being necessary for magnetron sputtering leaks out over the target surface without magnetic saturation of target materials. By using the GT target, the high rate sputtering of magnetic materials is possible even with common permanent magnets. For example, with a Fe target of 20 mm thick, the deposition rate of 1.5 μm/min. with 15 W/cm2power density is obtained by DC magnetron sputtering at argon pressure of10^{-2} sim 1.0pa.
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