| 铝/铜复合界面金属间化合物 |
| |
| 引用本文： | 李青云,;王明光.铝/铜复合界面金属间化合物[J].佳木斯工学院学报,2009(4):556-558. |
| |
| 作者姓名： | 李青云 ;王明光 |
| |
| 作者单位： | [1]沈阳化工学院,辽宁沈阳110142; [2]东北大学,辽宁沈阳110004 |
| |
| 摘 要： | 冷轧复合板轧制后要进行一定的热处理以加强界面的结合强度,但同时也带来一定的问题如在界面形成不利于界面结合的化合物.本文对冷轧制备的铝/铜层状双金属片进行了研究,得到了不同退火温度和退火时间下扩散热处理后界面金属间化合物相的生长规律,初步建立了金属间化合物形成的动力学模型.
|
| 关 键 词： | 金属间化合物 加热退火 生长动力学 |
The Intermetallic Compound in Al/Cu |
| |
| Affiliation: | LI Qing-yun,WANG Ming-guang (1.Shenyang Institute of Chemical Technology, Shenyang 110142, China; 2.The Northeast University, Shenyang 110004, China) |
| |
| Abstract: | The rolled composite can enhance the combined intensity after heat treatment but also can bring some problems such as intennetallic compounds. This paper investigated the forming rules of compounds in interface of the Al/Cu composite and got under different time and temperature. The kinetic model of intermetallic compound growth was built. |
| |
| Keywords: | intermetallics annealing growth kinetics |
| 本文献已被 维普 等数据库收录！ |
|
