| SiC／Cu粉团聚状态对SiC沉积率的影响 |
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| 引用本文： | 吴明忠. SiC／Cu粉团聚状态对SiC沉积率的影响[J]. 佳木斯工学院学报, 2009, 0(3): 388-389 |
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| 作者姓名： | 吴明忠 |
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| 作者单位： | 佳木斯大学材料科学与工程学院,黑龙江佳木斯154007 |
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| 摘 要： | 采用亚音速火焰喷涂技术制备了SiC／Cu金属基复合材料，研究了碳化硅与铜喷涂前团聚状态对碳化硅沉积率的影响．与未经团聚处理粉相比，SiC／Cu经团聚处理后沉积层中碳化硅沉积率高出1倍多．
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| 关 键 词： | 热喷涂 SiC/Cu 沉积率 |
Influence of Aggregating State of SiC/Cu Powders on Deposition Probability of SiC |
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| Affiliation: | WU Ming -Zhong (School of Material Science and Engineering, Jianmsi University, Jiamnci, Heilongjiang 154007, China) |
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| Abstract: | SiC/Cu metal matrix composite （MMC） was produced by subsonic thermal spray and the influence of aggregating state of SiC/Cu powder on deposition probability of SiC was studied. Compared to untreated powder, the deposition probability of SiC in the deposit layer which was made by aggregate powders was twice as much. |
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| Keywords: | thermal spraying SiC/Cu deposition propability |
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