| 球栅阵列——更适合多端子LSI的表面安装式封装 |
| |
| 引用本文： | 田民波,冯晓东.球栅阵列——更适合多端子LSI的表面安装式封装[J].微纳电子技术,1997(6). |
| |
| 作者姓名： | 田民波 冯晓东 |
| |
| 作者单位： | 清华大学材料科学与工程系 |
| |
| 摘 要： | 塑封球栅阵列（ＢＧＡ）是一种新型表面安装多端子型ＬＳＩ封装。与塑封四方扁平封装（ＱＦＰ）相比，前者外形更小，设备与操作较为简单，可靠性也有所提高。ＢＧＡ替代ＱＦＰ的尝试从美国开始，并正在各国展开
|
| 关 键 词： | 球栅阵列，四方扁平封装，带载封装 |
Ball Grid Array:A Better Method of Surface- Mounted Package for Multi-Lead LSI |
| |
| Abstract: | P BGA(plastic ball grid array)is a novel surface mounted package for multi lead LSI.Compared with P QFP(plastic quad flat package),P BGA becomes compacter,equipment and operation of P BGA become simpler and the realiablity is higher.The try in which QFP is substituted by BGA began in USA,spreading over many countries. |
| |
| Keywords: | BGA QFP TCP |
| 本文献已被 CNKI 等数据库收录！ |
|
