球栅阵列——更适合多端子LSI的表面安装式封装 |
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引用本文: | 田民波,冯晓东.球栅阵列——更适合多端子LSI的表面安装式封装[J].微纳电子技术,1997(6). |
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作者姓名: | 田民波 冯晓东 |
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作者单位: | 清华大学材料科学与工程系 |
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摘 要: | 塑封球栅阵列(BGA)是一种新型表面安装多端子型LSI封装。与塑封四方扁平封装(QFP)相比,前者外形更小,设备与操作较为简单,可靠性也有所提高。BGA替代QFP的尝试从美国开始,并正在各国展开
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关 键 词: | 球栅阵列,四方扁平封装,带载封装 |
Ball Grid Array:A Better Method of Surface- Mounted Package for Multi-Lead LSI |
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Abstract: | P BGA(plastic ball grid array)is a novel surface mounted package for multi lead LSI.Compared with P QFP(plastic quad flat package),P BGA becomes compacter,equipment and operation of P BGA become simpler and the realiablity is higher.The try in which QFP is substituted by BGA began in USA,spreading over many countries. |
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Keywords: | BGA QFP TCP |
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