The fracture resistance of a model metal/ceramic interface |
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| Affiliation: | 1. CEITEC IPM, Institute of Physics of Materials, Academy of Sciences of the Czech Republic, Žižkova 22, 616 62 Brno, Czech Republic;2. Brno University of Technology, Technická 2, 616 69 Brno, Czech Republic;1. Department of Physics, University of Wisconsin, Madison, 1150 University Avenue, Madison, WI 53706, USA;2. EFI and Department of Physics, University of Chicago, 5640 S. Ellis Av., Chicago, IL 60637, USA;1. College of Physics, Guizhou University, Guiyang 550025, PR China;2. Department of Physics, California State University, Northridge, CA 91330-8268, USA;1. Friedrich-Alexander Universität Erlangen-Nürnberg (FAU), Zahnklinik 1 – Zahnerhaltung und Parodontologie, Forschungslabor für dentale Biomaterialien, Glueckstrasse 11, 91054 Erlangen, Germany;2. Department of Restorative Dentistry, Faculty of Dentistry, University of Concepción, Concepción, Chile;3. Friedrich-Alexander Universität Erlangen-Nürnberg (FAU), Department Werkstoffwissehschaften, Lehrstuhl WW3: Glas und Keramik, Martenstrasse 5, 91058 Erlangen, Germany |
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| Abstract: | Crack propagation has been measured for the Al2O3/Au interface subject to conditions that exclude stress corrosion. Crack growth has been shown to occur with a rising resistance, governed by intact metal ligaments in the crack wake. The level of resistance also increases as the metal layer thickness increases. Crack extension occurs by a combination of plastic void growth and interface debonding. The fracture energies are much larger than the work of adhesion, but appreciably smaller than those expected for ductile interface fracture. The fracture energy is nevertheless dominated by plastic dissipation, which increases at larger metal layer thicknesses. |
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