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Three-dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules |
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| Authors: | P. AGYAKWA J. DAI J. LI B. MOUAWAD L. YANG M. CORFIELD C.M. JOHNSON |
| Affiliation: | 1. Department of Electrical & Electronic Engineering, University of Nottingham, University Park, Nottingham, UK;2. Dynex Semiconductor Ltd, Doddington Road, Lincoln, UK |
| Abstract: | |
| Keywords: | Correlative microscopy die attachment microstructure power electronics reliability sintered nanosilver thermomechanical fatigue X-ray tomography |