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Diode Laser Soldering Technology of Fine Pitch QFP Devices |
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| Authors: | XUE Songbai ZHANG Liang HAN Zongjie WANG Jianxin YU Shenglin College of Materials Science Technology Nanjing University of Aeronautics Astronautics Nanjing China School of Mechanical Electrical Engineering Xuzhou Normal University Xuzhou China The th Research Institute China Electronics Technology Group Corporation Nanjing China |
| Affiliation: | XUE Songbai1,*,ZHANG Liang1,2,HAN Zongjie3,WANG Jianxin1,and YU Shenglin3 1 College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China 2 School of Mechanical and Electrical Engineering,Xuzhou Normal University,Xuzhou 221116,China 3 The 14th Research Institute,China Electronics Technology Group Corporation,Nanjing 210013,China |
| Abstract: | The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with Sn-Ag-Cu lead-free solder and Sn-Pb solder respectively,and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR-1000 micro-joints tester.The results indicate that sound QFP micro-joints without bridging or solder ball are gained by means of diode laser s... |
| Keywords: | diode laser soldering QFP device mechanical properties of micro-joint |
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