| 新型Sn-Ag-Cu-Cr无铅焊料合金的研究 |
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| 引用本文： | 张富文,刘静,杨福宝,胡强,贺会军,朱学新,徐骏,石力开.新型Sn-Ag-Cu-Cr无铅焊料合金的研究[J].电子元件与材料,2005,24(11):45-48. |
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| 作者姓名： | 张富文 刘静 杨福宝 胡强 贺会军 朱学新 徐骏 石力开 |
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| 作者单位： | 北京有色金属研究总院,北京,100088;北京康普锡威焊料有限公司,北京,100088;北京有色金属研究总院,北京,100088;北京康普锡威焊料有限公司,北京,100088 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 对新型Sn-Ag-Cu-Cr无铅焊料进行了熔点、力学性能、润湿性能等的测试,并从微观方面分析了Cr对Sn-Ag-Cu系无铅焊料的作用规律机理。结果表明:Cr的加入对材料力学性能的影响较为显著,当Cr含量(质量分数)在0.1%左右时可提高焊料的各项力学性能指标,而当含量过高后,又将降低材料的强度,提高脆性,Cr含量少于0.5%时,对焊料的熔点影响较小,而Cr的加入对焊料的铺展性能却有降低作用。
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| 关 键 词： | 金属材料 无铅焊料 Sn-Ag-Cu-Cr熔点 力学性能 润湿性 |
| 文章编号： | 1001-2028（2005）11-0045-04 |
| 收稿时间： | 2005-06-13 |
| 修稿时间： | 2005-06-13 |
A New Type Sn-Ag-Cu-Cr Lead-free Solder |
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| ZHANG Fu-wen,LIU-Jing,YANG Fu-bao,HU Qiang,HE Hui-jun,ZHU Xue-xin,XU Jun,SHI Li-kai.A New Type Sn-Ag-Cu-Cr Lead-free Solder[J].Electronic Components & Materials,2005,24(11):45-48. |
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| Authors: | ZHANG Fu-wen LIU-Jing YANG Fu-bao HU Qiang HE Hui-jun ZHU Xue-xin XU Jun SHI Li-kai |
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| Affiliation: | 1. Beijing Genaral Research Institute for Non-ferrous Metals, Beijing 100088, China; 2. Beijing Kangpuxiwei Welding Material Co., Ltd, Beijing 100088, China |
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| Abstract: | The Sn-Ag-Cu solder was researched.Specially,the melting point,mechanical properties and wetting property was analyzed.Furthermore,the effect mechanism of Cr element was analyzed from the microstructure.The results show that Cr-element affects the lead-free solder on mechanical property in particularly.While the w(Cr) is about 0.1%,the alloy shows the best strength and elongation which is obviously superior to Sn-Ag-Cu solder.However,above the critical value content,property may be deteriorated.And the high Cr content alloys exhibit the more fragility.Additionally,the Cr affects the melting point slightly while the w(Cr) is below 0.5%,and it can reduce the spreading area by reason of the oxidization. |
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| Keywords: | metal materials Lead-free solder Sn-Ag-Cu-Cr melting point mechanical property wettability |
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