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致冷型红外CMOS读出集成电路的发展现状
引用本文:刘成康,李兵,汪涛,袁祥辉.致冷型红外CMOS读出集成电路的发展现状[J].红外技术,2000,22(4):39-41,46.
作者姓名:刘成康  李兵  汪涛  袁祥辉
作者单位:重庆大学,光电工程学院,重庆,400044
摘    要:致冷型红外读出集成电路经历了20多年的发展,其技术已日臻完善,CMOS读出电路是当今读出电路的主流,其发展趋势是减小像元间距,增加焦平面阵列像元数而又不降低其光电性能.将滤波电路、A/D转换等功能器件集成在同一芯片上也是读出电路的发展方向.

关 键 词:红外焦平面阵列  读出电路  CMOS  集成电路
文章编号:1001-8891(2000)04-0039-03

Status of CMOS ROIC for Cooled IRFPA
LIU Cheng-kang,LI Bing,WANG Tao,YUAN Xang-hui.Status of CMOS ROIC for Cooled IRFPA[J].Infrared Technology,2000,22(4):39-41,46.
Authors:LIU Cheng-kang  LI Bing  WANG Tao  YUAN Xang-hui
Affiliation:LIU Cheng-kang ,LI Bing ,WANG Tao ,YUAN Xang-hui (Chongqing University ,Chogqing,400044)
Abstract:The technology of IRFPA ROIC has been developed for more tham twenty years and is becoming maturer .Now, as a main IRFPA ROIC, andCMOS IR ROIC is going to decrease the pitch and increase the number of detectors without degrading the electro optical performances.IRFPA ROIC with some functional devices,such as. A/D conversion,filter and so on,are being developed.
Keywords:IRFPA  IC  CMOS  readout circuit
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