| 圆片级低温富锡金锡键合 |
| |
| 引用本文： | Fang Zhiqiang,Mao Xu,Yang Jinling,Yang Fuhua. 圆片级低温富锡金锡键合[J]. 半导体学报, 2013, 34(10): 106001-4 |
| |
| 作者姓名： | Fang Zhiqiang Mao Xu Yang Jinling Yang Fuhua |
| |
| 作者单位： | Research Center of Engineering for Semiconductor Integrated Technology,Institute of Semiconductors,Chinese Academy of Sciences;State Key Laboratory of Transducer Technology |
| |
| 基金项目： | MEMS packaging; Au-Sn solder; Sn-rich; bonding strength |
| |
| 摘 要： | Sn-rich Au–Sn solder bonding has been systematically investigated for low cost and low temperature wafer-level packaging of high-end MEMS devices.The AuSn2 phase with the highest Vickers-hardness among the four stable intermetallic compounds of the Au–Sn system makes a major contribution to the high bonding shear strength.The maximum shear strength of 64 MPa and a leak rate lower than 4.9×10-7 atm·cc/s have been obtained for Au46Sn54 solder bonded at 310 ℃.This wafer-level low cost bonding technique with high bonding strength can be applied to MEMS devices requiring low temperature packaging.
|
| 关 键 词： | MEMS packaging Au–Sn solder Sn-rich bonding strength |
| 收稿时间： | 2013-03-07 |
Low temperature Sn-rich Au-Sn wafer-level bonding |
| |
| Fang Zhiqiang,Mao Xu,Yang Jinling and Yang Fuhua. Low temperature Sn-rich Au-Sn wafer-level bonding[J]. Chinese Journal of Semiconductors, 2013, 34(10): 106001-4 |
| |
| Authors: | Fang Zhiqiang Mao Xu Yang Jinling Yang Fuhua |
| |
| Affiliation: | Research Center of Engineering for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Research Center of Engineering for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Research Center of Engineering for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Research Center of Engineering for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China; |
| |
| Abstract: | MEMS packaging Au-Sn solder Sn-rich bonding strength |
| |
| Keywords: | MEMS packaging Au-Sn solder Sn-rich bonding strength |
| 本文献已被 CNKI 维普 等数据库收录！ |
| 点击此处可从《半导体学报》浏览原始摘要信息 |
|
点击此处可从《半导体学报》下载全文 |
|
