Fabrication of cylindrical SiCf/Si/SiC-based composite by electrophoretic deposition and liquid silicon infiltration |
| |
| Affiliation: | 1. ICIMSI, SUPSI, Galleria 2, CH-6928 Manno, Switzerland;2. Institute of Solar Research, German Aerospace Center, Linder Höhe, 51147 Köln, Germany;3. School of Materials Science and Engineering, Yeungnam University, Gyeongsan 712-749, Republic of Korea;1. State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, PR China;2. Graduate University of Chinese Academy of Sciences, Beijing 100039, PR China;1. School of Rare Earth, Inner Mongolia University of Science and Technology, Baotou 014010, China;2. Functional Materials Research Laboratory, Tongji University, 1239 Siping Road, Shanghai 200092, China;1. Department of Materials Science and Engineering, Texas A&M University, TX, USA;2. Department of Mechanical Engineering, Texas A&M University, TX, USA;3. Department of Industrial and Systems Engineering, Texas A&M University, TX, USA;4. Department of Engineering Technology and Industrial Distribution, Texas A&M University, TX, USA |
| |
| Abstract: | Cylindrical SiC-based composites composed of inner Si/SiC reticulated foam and outer Si-infiltrated SiC fiber-reinforced SiC (SiCf/Si/SiC) skin were fabricated by the electrophoretic deposition of matrix particles into SiC fabrics followed by Si-infiltration for high temperature heat exchanger applications. An electrophoretic deposition combined with ultrasonication was used to fabricate a tubular SiCf/SiC skin layer, which infiltrated SiC and carbon particles effectively into the voids of SiC fabrics by minimizing the surface sealing effect. After liquid silicon infiltration at 1550 °C, the composite revealed a density of 2.75 g/cm3 along with a well-joined interface between the inside Si/SiC foam and outer SiCf/Si/SiC skin layer. The results also showed that the skin layer, which was composed of 81.4 wt% β-SiC, 17.2 wt% Si and 1.4 wt% SiO2, exhibited a gastight dense microstructure and the flexural strength of 192.3 MPa. |
| |
| Keywords: | SiC composites Electrophoretic deposition Silicon infiltration |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
