| 用于超紧凑功率模块的SKiN技术 |
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| 引用本文： | Thomas GraBhoff. 用于超紧凑功率模块的SKiN技术[J]. 电源世界, 2012, 0(12): 44-46,50 |
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| 作者姓名： | Thomas GraBhoff |
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| 作者单位： | 赛米控国际有限公司,纽伦堡 德国 |
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| 摘 要： | SKiN技术是使用烧结层替代焊接的新技术,通过无绑定线封装技术平台增强了可靠性、减小了热阻、并改进了内部寄生电感。本文介绍了采用该技术设计的功率模块的性能特点,并进行了样机测试。
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| 关 键 词： | SkiN技术 烧结 功率模块 |
SKiN Technology for Ultra Compact Power Modules |
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| Affiliation: | Thomas GraBhoff Semikron (Nuremberg, Germany) |
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| Abstract: | Skin technology is a new one applying sintered layer instead of welding, which enhances reliability, reduces thermal resistance, improves internal parasitic inductance, through no-bond-wire encapsulation technology platform. The article introduces performance and features of the power module applying this technology, and demo test is conducted in the meantime. |
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| Keywords: | Skin Technology Sintering Power Module |
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