| 一种高性能实用型Sn-Cu无铅电子钎料 |
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| 引用本文： | 晏勇,蒋晓虎,张继忠,徐建洋. 一种高性能实用型Sn-Cu无铅电子钎料[J]. 电子元件与材料, 2005, 24(4): 54-56 |
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| 作者姓名： | 晏勇 蒋晓虎 张继忠 徐建洋 |
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| 作者单位： | 四川省有色冶金研究院有色金属材料研究所,四川,成都,610081;四川省有色冶金研究院有色金属材料研究所,四川,成都,610081;四川省有色冶金研究院有色金属材料研究所,四川,成都,610081;四川省有色冶金研究院有色金属材料研究所,四川,成都,610081 |
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| 摘 要： | 研制了一种具有自主知识产权的高性能无铅电子钎料CWB—07系列。它采用在Sn-Cu基体合金中加入Ni、Re、P等多种改性元素的方式,全面改善和提高了钎料的综合性能。经检测、对比和应用试验,证明本产品具有较高的性价比和较强的实用性。抗拉强度达到45MPa,超过Sn-3.5Ag,经济指数优于Sn-3.5Ag和Sn63Pb。
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| 关 键 词： | 金属材料 无铅钎料 熔点 扩展率 力学性能 实用性 |
| 文章编号： | 1001-2028(2005)04-0054-03 |
High Performances Sn-Cu Electronic Lead-free Solder |
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| YAN Yong,JIANG Xiao-hu,ZHANG Ji-zhong,Xu Jian-yang. High Performances Sn-Cu Electronic Lead-free Solder[J]. Electronic Components & Materials, 2005, 24(4): 54-56 |
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| Authors: | YAN Yong JIANG Xiao-hu ZHANG Ji-zhong Xu Jian-yang |
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| Abstract: | High performance electronic lead free solder CWB—07 series were developed. This new variety of solder obtains developed physical characteristics and improved welding techniques by adding in multi-modified elements Ni、Re、P et al to Sn-Cu matrix alloy, resulting in better economical efficiency and practicability. Tensile strength is to 45 MPa, exceeds Sn-3.5Ag. Economy will be better than Sn-3.5Ag and Sn63Pb. |
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| Keywords: | metal materials lead free solder melting point rate of spread mechanical property practicability |
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