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| 环氧树脂E-44反应增容尼龙6/废印刷电路板非金属粉复合材料的力学性能和热变形温度研究 | |
| 引用本文： | 欧阳杰,李渊,王曦,孟勇,苏胜培. 环氧树脂E-44反应增容尼龙6/废印刷电路板非金属粉复合材料的力学性能和热变形温度研究[J]. 精细化工中间体, 2011, 41(5): 61-66 |
| 作者姓名： | 欧阳杰 李渊 王曦 孟勇 苏胜培 |
| 作者单位： | 1. 资源精细化与先进材料湖南省普通高校重点实验室,湖南长沙,410081 2. 湖南师范大学资源循环综合技术研究中心,湖南长沙,410081 3. 资源精细化与先进材料湖南省普通高校重点实验室,湖南长沙410081;湖南师范大学资源循环综合技术研究中心,湖南长沙410081 |
| 基金项目： | 湖南师范大学潇湘学者启动资金资助课题(化050613) |
| 摘 要： | 用环氧树脂E-44作为反应性的增容剂,采用熔融共混方法制备了尼龙6(PA6)/废印刷电路板非金属粉(N-PCB)复合材料。研究了E-44用量、挤出温度以及N-PCB粉末的粒径大小对PA6/N-PCB复合材料力学性能和热变形温度的影响。对复合材料抽提残留物的红外分析实验结果表明E-44与PA6/N-PCB复合材料中PA6以及N-PCB粉末表面发生了化学键合。添加1.25份E-44的PA6/N-PCB复合材料与纯PA6相比,其拉伸强度、拉伸模量、弯曲强度和弯曲模量最大增幅分别为29%、49%、73%和72%,热变形温度提高了42.8℃,但其韧性降低。与未加增容剂相比,其拉伸强度、弯曲强度和缺口冲击强度最大增幅分别为9%、8%和43%,热变形温度提高了9.3℃。 |
| 关 键 词： | 环氧树脂(E-44) 尼龙6 废印刷电路板非金属粉 增容 |
Study on the Mechanical and Heat Distortion Temperature of Polyamide 6/Nonmetals Recycled from Waste PCB Composites Compatibilized by Epoxy Resin(E-44) |
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| OUYANG Jie,LI Yuan,WANG Xi,MENG Yong,SU Sheng-pei. Study on the Mechanical and Heat Distortion Temperature of Polyamide 6/Nonmetals Recycled from Waste PCB Composites Compatibilized by Epoxy Resin(E-44)[J]. Fine Chemical Intermediates, 2011, 41(5): 61-66 | |
| Authors: | OUYANG Jie LI Yuan WANG Xi MENG Yong SU Sheng-pei |
| Affiliation: | OUYANG Jie1,LI Yuan1,WANG Xi1,MENG Yong2,SU Sheng-pei 1,2(1.College of Chemistry and Chemical Engineering,Key Lab of Sustainable Resources Processing and Advanced Materials,Hunan Normal University,Changsha 410081,China,2.College of Chemistry and Chemical Engineering,Recycling Integrated Technology Research Center,China) |
| Abstract: | Polyamide 6(PA6) matrix composites,reinforced with nonmetals recycled from waste printed circuit boards(N-PCB)and compatibilized with epoxy resin(E-44),was prepared by the melt blending method.The effects of E-44 dosage,extrusion temperature and N-PCB particle sizes on the mechanical properties and heat distortion temperature of PA6/N-PCB composites were investigated.The results showed that there were chemical reactions occurred between the components of PA6/N-PCB composites,proved by both FT-IR analysis an... |
| Keywords: | epoxy resin(E-44) polyamide 6 nonmetals recycled from waste PCB compatibilization |
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