| Sn-Ag共晶钎料与Cu基板界面反应的热力学计算 |
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| 引用本文： | 梁英,孙凤莲,王丽凤. Sn-Ag共晶钎料与Cu基板界面反应的热力学计算[J]. 哈尔滨理工大学学报, 2005, 10(5): 80-83 |
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| 作者姓名： | 梁英 孙凤莲 王丽凤 |
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| 作者单位： | 哈尔滨理工大学材,料科学与工程学院,黑龙江,哈尔滨,150040;哈尔滨理工大学材,料科学与工程学院,黑龙江,哈尔滨,150040;哈尔滨理工大学材,料科学与工程学院,黑龙江,哈尔滨,150040 |
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| 摘 要： | 为探讨热力学计算在无铅焊料的设计与研究领域中的应用，依据局部平衡理论，通过热力学相图计算，采用商业计算软件Thermo—Calc进行了计算与模拟工作．预测出250℃焊接温度下Sn—Ag共晶焊料与Cu基板界面处金属间化合物的形成序列；根据Scheil-Gulliver模型模拟了剩余液态钎料非平衡凝固过程，对相演变信息进行了预测．综合计算模拟结果，确定焊接接头的组织是由Cu6Sn5、Cu3Sn、、Ag3Sn和富Sn相（BCT—Sn）组成，有效地预测了界面反应行为，与实验结果吻合较好．
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| 关 键 词： | Sn-Ag/Cu界面反应 热力学相图计算 计算模拟 |
| 文章编号： | 1007-2683(2005)05-0080-04 |
| 修稿时间： | 2005-03-31 |
Thermodynamic Calculation Analysis of Interfacial Reaction between Sn-Ag and Cu Substrate |
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| LIANG Ying,SUN Feng-lian,WANG Li-feng. Thermodynamic Calculation Analysis of Interfacial Reaction between Sn-Ag and Cu Substrate[J]. Journal of Harbin University of Science and Technology, 2005, 10(5): 80-83 |
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| Authors: | LIANG Ying SUN Feng-lian WANG Li-feng |
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| Abstract: | In order to examine the applied potential of thermodynamic calculation in the field of designing and studying on Lead free solders, we did some calculation and simulation work by using Thermo-Calc software. According to the local equlibria theory, through calculating metastable equilibria between Cu substrate and the liquid Sn-Ag solder, the compounds forming sequences has been predicted; we simulated the Liquid solder solidification process in accordance with Scheil-Gulliver model and predicted the phases transformation information during cooling. It can be concluded that the final joint microstructure consists of Cu6Sn5 Cu3Sn Ag3Sn and Sn-rich phase (BCT-Sn), which is consistent with the previous experimental results. |
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| Keywords: | Sn-Ag/Cu interfacial reaction thermodynamic phase calculation simulation |
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