| 界面结合强度对C/Cu 复合材料热膨胀性能的影响 |
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| 引用本文： | 王玉林,万怡灶,成国祥,董向红,周福刚. 界面结合强度对C/Cu 复合材料热膨胀性能的影响[J]. 复合材料学报, 1998, 15(1): 83-87 |
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| 作者姓名： | 王玉林 万怡灶 成国祥 董向红 周福刚 |
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| 作者单位： | 天津大学材料系, 天津 300072 |
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| 摘 要： | 本文通过在C/C u 复合材料的Cu 基体中添加不同的合金元素(Sn,Ni, Fe) 获得不同的界面结合强度, 研究了界面结合强度对C/C u 复合材料热膨胀特性的影响规律, 并分析了界面结合强度对降温过程中复合材料的收缩特性及残余应变的影响。
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| 关 键 词： | C/Cu 复合材料 界面结合强度 热膨胀性能 残余应变 |
| 收稿时间： | 1996-07-03 |
| 修稿时间： | 1996-11-12 |
EFFECT OF INTERFACE BONDING STRENGTH ON THE THERMAL EXPANSION BEHAVIOR OF C/Cu COMPOSITES |
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| Wang Yu-lin,Wan Yi-zao,Cheng Guo-xiang,Dong Xiang-hong,Zhou Fu-gang. EFFECT OF INTERFACE BONDING STRENGTH ON THE THERMAL EXPANSION BEHAVIOR OF C/Cu COMPOSITES[J]. Acta Materiae Compositae Sinica, 1998, 15(1): 83-87 |
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| Authors: | Wang Yu-lin Wan Yi-zao Cheng Guo-xiang Dong Xiang-hong Zhou Fu-gang |
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| Affiliation: | Dept. of Materials Science and Engineering, Tianjin University, Tianjin 300072 |
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| Abstract: | C/Cu composites with different interface bonding strength have been fabricated by adding Sn,Ni or Fe element to the copper matrix. The effect of interface bonding strength on the thermal expansion behavior of C/Cu composites has been investigated. Its influence on the contracting behavior (occurring at the cooling stage) and the residual strain values of composites has also been studied in this paper. |
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| Keywords: | C/Cu composites interface bonding strength thermal expansion behavior residual strain |
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