| 抗氧化树脂包覆焊粉的研究 |
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| 引用本文： | 林延勇,夏志东,雷永平.抗氧化树脂包覆焊粉的研究[J].电子元件与材料,2010,29(4). |
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| 作者姓名： | 林延勇 夏志东 雷永平 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100124 |
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| 基金项目： | 北京市属市管高等学校人才强教计划资助项目;;北京市创新团队“环境协调连接材料及加工技术”计划资助项目 |
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| 摘 要： | 采用有机树脂溶液浸泡焊粉的方法,制备了一种有机树脂包覆焊粉;通过电阻率测试和扫描电镜观察,对焊粉包覆层的质量进行了评价;通过对加速氧化过的焊粉进行铺展和成球试验,研究了树脂包覆层的抗氧化效果。结果表明:本研究所制包覆焊粉,具有均匀的树脂包覆层,且保持了原焊粉的粒度和球形度;包覆焊粉的铺展和成球试验结果均达到了SJ/T11186—1998规定的2级标准,说明包覆焊粉具有比原焊粉更好的抗氧化能力。
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| 关 键 词： | 焊膏 树脂包覆焊粉 抗氧化 |
Study on the solder powder coated with antioxidative resin |
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| LIN Yanyong,XIA Zhidong,LEI Yongping.Study on the solder powder coated with antioxidative resin[J].Electronic Components & Materials,2010,29(4). |
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| Authors: | LIN Yanyong XIA Zhidong LEI Yongping |
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| Affiliation: | College of Materials Science and Engineering;Beijing University of Technology;Beijing 100124;China |
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| Abstract: | A kind of resin-coated solder powder was prepared by immersing solder powder in the resin. The quality of the resin coating was evaluated according to the resistivity measurements and SEM observations, while the antioxidative effects of the resin coating were studied through performing the wetting test and solder ball test for the oxidized solder powder. The prepared resin-coated solder powders are covered by a layer of resin with constant thickness, and few changes in the size and shape of the solder powde... |
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| Keywords: | solder paste resin-coated solder powder antioxidation |
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