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Lapping performance guide of poly-crystal diamond particles through morphological analysis
Affiliation:1. Institute of Laser Engineering, Osaka University, 2-6 Yamadaoka, Suita, Osaka 565-0871, Japan;2. Diamond Wafer Team, Advanced Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology, 1-8-31 Midorigaoka, Ikeda, Osaka 563-0026, Japan;3. Graduate School for the Creation of New Photon Industries, 1955-1 Kurematsu, Nishiku, Hamamatsu, Shizuoka 141-1201, Japan;4. Institute for Laser Technology, 2-6 Yamadaoka, Suita, Osaka 565-0871, Japan;5. Joining and Welding Research Institute, Osaka University, 11-1, Mihogaoka, Ibaraeki, Osaka 567-0047, Japan;6. National Institute for Fusion Science, 332-6 Oroshicho, Toki, Gifu 509-5202, Japan;1. Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Chuo-ku, Kumamoto 860-8555, Japan;2. Magnesium Research Center, Kumamoto University, 2-39-1 Kurokami, Chuo-ku, Kumamoto 860-8555, Japan;1. Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, PR China;2. School of Mechanical and Materials Engineering, North China University of Technology, Beijing 100144, PR China;3. Shunde Innovation School, University of Science and Technology Beijing, Foshan 528399, PR China;4. Institute of Process Engineering, Chinese Academy of Science, Beijing 100190, PR China;5. State Key Laboratory of Advanced Metallurgy, University of Science and Technology Beijing, Beijing 100083, PR China
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