Electroless plating of palladium and copper on polypyrrole films |
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| Affiliation: | 1. School of Environmental Science and Engineering, Donghua University, Shanghai 201620, China;2. School of Chemical and Environmental Engineering, Hunan City University, Yiyang 413000, China;3. Shanghai Institute of Technology, Shanghai 200235, China;1. College of Physics and Information Engineering, Henan Normal University, Xinxiang 453007, China;2. Henan Province Key Laboratory of Photovoltaic Materials, Xinxiang 453007, China;1. State Key Laboratory of High Performance Ceramics and Superfine Microstructures, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China;2. The Key Laboratory of Inorganic Functional Materials and Device, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China;3. University of Chinese Academy of Sciences, Beijing 100049, China |
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| Abstract: | A novel process for the metallization of polypyrrole (PPY) film surface through consecutive electroless plating of palladium and copper in the complete absence of the SnCl2 sensitization step was demonstrated. X-ray photoelectron spectroscopy (XPS) technique was used to characterize the polymer surface at each stage of the metallization process. It was found that only the fully reduced PPY film could reduce palladium ions to palladium metal (Pd(0)) in substantial amounts from either the Pd(NO3)2 or PdCl2 acid solution. The palladium metal was necessary for catalyzing the subsequent electroless plating of copper. The reduction of Pd(II) ions in acid solution to Pd(0) on the film surface was accompanied by a simultaneous increase in intrinsic oxidation state and doping level of the film. The copper plating process after the palladium uptake step was highly dependent on the [Pd]/[N] ratio on the film. Through XPS and Auger photoeletron spectroscopy measurements, it was postulated that during the electroless copper plating process, the Cu(II) ions were first reduced to Cu(I) on the PPY film surface before complete reduction to copper metal. |
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