HEDP镀铜液在铜电极上的电化学行为

采用测量开路电位-时间曲线和阴极极化曲线的方法,研究了铜电极上HEDP镀铜的电化学行为.结果表明,HEDP体系的溶液组成与温度都会影响铜电极的稳定开路电位,电镀铜过程的阴极极化(镀层结晶质量)与极化度(镀液分散能力).溶液中HEDP浓度升高,则稳定开路电位变负,阴极极化和极化度增大,有利于电沉积铜的电极过程.溶液pH升高时,稳定开路电位变负,电沉积铜的阴极极化增大.溶液温度降低时,电沉积铜的阴极极化增大.阴极极化较小时的极化度较大,且随pH的升高或温度的降低而明显增大.

Electrochemical behavior of copper plating on copper electrode in HEDP solution

The electrochemical behavior of Cu electroplating on Cu electrode in a HEDP solution was studied by measuring open circuit potential vs. time curves and cathodic polarization curves. The results showed that both composition and temperature of the plating bath can affect the stable open circuit potential of copper electrode, cathodic polarization of copper electroplating process (crystallization quality) and polarizability (throwing power of the electroplating bath). The stable open circuit potential is decreased and the cathodic polarization and polarizability are increased with increasing concentration of HEDP. As a result, the electrode process of Cu deposition is facilitated. The stable open circuit potential shifts towards negative and the cathodic polarization is increased with increasing pH. The decrease of bath temperature increases the cathodic polarization. The polarizability is high at low cathodic polarization and increased evidently with increasing pH or decreasing bath temperature.