| BGA组装技术及其质量控制 |
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| 引用本文： | 江平.BGA组装技术及其质量控制[J].电子工艺技术,2012(1):34-37. |
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| 作者姓名： | 江平 |
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| 作者单位： | 中国电子科技集团公司第十研究所 |
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| 摘 要： | BGA器件已越来越广泛地应用到电子产品中,并且随着μBGA和CSP的出现,组装难度越来越大,工艺要求也越来越高。主要分析了影响BGA组装质量的各个环节因素,从工艺控制、组装操作、管理和检测判定等四个方面详细阐述了控制质量关键点及实施要求。
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| 关 键 词： | BGA 电子组装 温度曲线 质量控制 检测判定 |
Assembly Technology and Quality Control of BGA |
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| JIANG Ping.Assembly Technology and Quality Control of BGA[J].Electronics Process Technology,2012(1):34-37. |
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| Authors: | JIANG Ping |
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| Affiliation: | JIANG Ping(No.10 Institute of CETC,Chengdu 610036,China) |
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| Abstract: | BGA devices have been more and more widely applied to electronic products,and with the development of BGA and CSP,the assembly is more difficulty and technology requirements are also getting higher and higher.Mainly analyze the effect of factors on BGA assembly quality.Elaborate the quality control key points and implementation requirements from the process control,assembly operation,inspection and management. |
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| Keywords: | BGA Electronic assembly Temperature profile Quality control Inspection |
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