Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints |
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| Authors: | R. S. Lai K. L. Lin B. Salam |
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| Affiliation: | (1) Department of Materials Science and Engineering, Frontier Material and Micro/Nano Science and Technology Center, National Cheng-Kung University, Tainan, 70101, Taiwan, ROC |
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| Abstract: | Cu5Zn8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver. |
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| Keywords: | Intermetallic compound lead-free solder Sn-Zn alloy |
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