| 表面安装PCB设计工艺 |
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| 引用本文： | 鲜飞. 表面安装PCB设计工艺[J]. 电子与封装, 2004, 4(1): 28-33,27 |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | 表面安装技术在电子产品组装生产过程中正得到广泛应用。而印制板的合理设计是SMT技术中的关键,也是SMT工艺质量的保证,本文就表面安装PCB设计时需考虑的一些制造工艺性问题进行了阐述,给SMT设计人员提供一个参考。
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| 关 键 词： | 印制板 基准标志 导通孔 波峰焊 再流焊 可测性设计 |
Introduction of SMT Processing Technology on PCB Designs |
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| XIAN Fei. Introduction of SMT Processing Technology on PCB Designs[J]. Electronics & Packaging, 2004, 4(1): 28-33,27 |
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| Authors: | XIAN Fei |
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| Abstract: | Surface Mount Technology is extensively applied in the assembly of electronic components and PCB, PCB designs is the key of surface Mount Technology and guarantee of SMT quality. The paper illustrates some of the concerns in SMT processing Technology on PCB designs, offer a reference for SMT designer. |
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| Keywords: | PCB Fiducial sign Through hole Wave soldering Reflow soldering Design for Testability |
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