一种基于厚膜工艺的电路版图设计

在电子线路版图设计中,通常采用印刷线路板技术。如果结合厚膜工艺技术,可以实现元器件数目繁多,电路连接复杂,且安装空间狭小的电路版图设计。通过对3种不同电路版图设计方案的理论分析,确定了惟一能满足要求的设计方案。基于外形尺寸的要求,综合考虑电路的性能和元件的封装形式,通过合理的电路分割和布局设计,验证了设计方案的合理性和可实现性。体现了厚膜工艺技术在电路版图设计中强大的优越性,使一个按常规的方法无法实现的电路版图设计问题迎刃而解。

Circuit layout design based on thick-film process

The printed circuit board（PCB）technology is applied to circuit design generally. If it is combined with thick-film process,the circuit layout design,in which the complicated connection and many devices are mounted in its limited room, can be implemented. The outstanding advantages of the thick-film hybrid circuit were demonstrated by theoretical analysis of three defferent design schemes of circuit layout design. It is the unique one which can meet the requirement of the circuit design scheme. According to the boundary dimension requirement of the circuit,the circuit performance and device encapsulation mode were considered thoroughly,and the rationality and realizability of the design scheme were validated by reasonable circuit seg-menting design and layout design. The outstanding superiority of thick-film process was reflected in the circuit layout design. The difficulty that the conventional methods for circuit layout design could not overcome was solved easily .