| 焊膏印刷设备的可靠性研究 |
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| 引用本文： | 朱桂兵. 焊膏印刷设备的可靠性研究[J]. 丝网印刷, 2007, 0(3): 33-36 |
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| 作者姓名： | 朱桂兵 |
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| 作者单位： | 中北大学 |
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| 摘 要： | SMT生产工艺决定了电子产品的可靠性,焊膏印刷质量的好坏是其关键因素之一。从设备结构、焊膏印刷的过程等角度分析了焊膏缺陷产生的可能性,并介绍了其解决办法。
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| 关 键 词： | 表面贴装 焊膏 故障排除 |
| 修稿时间： | 2007-01-15 |
The Reliability of Solder Paste Printing Equipment |
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| Zhu Guibing. The Reliability of Solder Paste Printing Equipment[J]. Screen Printing, 2007, 0(3): 33-36 |
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| Authors: | Zhu Guibing |
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| Abstract: | Surface mounting technology decides the reliability of electronic products.The quality of solder paste printing is one of the key factors,This article analysis the possibility defects caused by equipment structure and printing process,Some solutions are also offered. |
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| Keywords: | SMT Solder paste troubleshooting |
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