Evaluation of analytical models for thermal analysis and design of electronic packages |
| |
Authors: | S Moghaddam M RadaA Shooshtari M OhadiY Joshi |
| |
Affiliation: | a Mechanical Department, University of Maryland at College Park, College Park, MD 20742, USA b Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA 30332, USA |
| |
Abstract: | The objective of this study is to evaluate the use of several analytical compact heat transfer models for thermal design, optimization, and performance evaluation in electronic packaging. A model for heat spreading in orthotropic materials is developed. The developed model is used in conjunction with the other available heat transfer models in a resistance network for calculation of heat transfer rate and junction temperatures in a multi-chip module (MCM). Refrigeration cooled MCM of an IBM server is used to illustrate the methodology. Results of the analytical model and resistance network analysis are compared with a numerical solution. Capability of the analytical model in predicting the thermal field is discussed and effectiveness of using the analytical models in thermal design and optimization of electronic packages is demonstrated. |
| |
Keywords: | Orthotropic material Heat spreading Numerical modeling Electronic packaging Multi-chip module Resistance network analysis |
本文献已被 ScienceDirect 等数据库收录! |
|