| 双向电流应力下的金属膜电迁移机理研究 |
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| 引用本文： | 章晓文,恩云飞. 双向电流应力下的金属膜电迁移机理研究[J]. 电子产品可靠性与环境试验, 2004, 0(2): 6-9 |
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| 作者姓名： | 章晓文 恩云飞 |
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| 作者单位： | 信息产业部电子第五研究所,广东,广州,510610;电子元器件可靠性物理及其应用技术国家重点实验室,广东,广州,510610;信息产业部电子第五研究所,广东,广州,510610;电子元器件可靠性物理及其应用技术国家重点实验室,广东,广州,510610 |
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| 基金项目： | 电子元器件可靠性物理及其应用技术国家重点实验室基金(51433020101DZ1504)资助。 |
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| 摘 要： | 对脉冲应力作用下金属铝膜的电迁移失效机理进行了研究，研究了纯交流应力对金属铝膜电迁移可靠性的影响，对影响测试结构的相关因素作了详细的描述。借助于脉冲波形的傅里叶级数分解，研究了一般交流应力条件下金属化电迁移的影响因素。建立了一般交流应力条件下金属铝膜电迁移寿命模型。
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| 关 键 词： | 金属铝膜 纯交流应力 一般交流应力 电迁移 失效机理 寿命模型 |
| 文章编号： | 1672-5468(2004)02-04 |
| 修稿时间： | 2003-10-24 |
Aluminium Film EM Mechanism Study under Bidirectional Current Stressing |
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| ZHANG Xiao-wen,EN Yun-fei. Aluminium Film EM Mechanism Study under Bidirectional Current Stressing[J]. Electronic Product Reliability and Environmental Testing, 2004, 0(2): 6-9 |
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| Authors: | ZHANG Xiao-wen EN Yun-fei |
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| Abstract: | Metal Aluminium film EM failure mechanism has been studied under pulsed stress, and the Metal Aluminium EM reliability under pure AC stress has been discussed, a detailed specification has been made about relative factor affecting test structures. Metal Aluminium film EM in general AC stress has been researched with Fourier decomposition, developing a Metal Aluminium film EM life model under in general AC stress. |
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| Keywords: | aluminium film pure AC stress general AC stress EM failure mechanism life model |
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