Modeling and Prediction of Thermal Cycle Induced Failure in Epoxy-Silica Composites

Epoxy resins filled with dielectric mineral particles are frequently used as insulating materials in power industry applications. Due to their excellent dielectric properties and relatively good thermal performance (resistance, ageing and conductivity) their usability is common and extensive. However, the mechanical performance of the resins is influenced by several factors such as resistance to crack propagation, especially in low temperature applications. This phenomenon is normally linked with appearance of two phase systems where particle filled epoxy material interacts with metallic inserts having significantly different thermal expansion coefficients. This kind of epoxy-metal interface can produce relatively high stresses in the product structure during thermal cycle loading. The paper deals with mechanical problems of power industry products and introduces the methodology for numerical modeling of failure in silica filled epoxy systems subjected to severe temperature gradients. Various aspects of material behavior modeling are covered in this article, including polymerization process, viscoelastic stress relaxation as well as stochastic cracking.