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溅射——气体——聚集共沉积法制备金属/金属(介质)复合团簇镶嵌薄膜
引用本文:王浩.溅射——气体——聚集共沉积法制备金属/金属(介质)复合团簇镶嵌薄膜[J].真空与低温,1997,3(2):70-73.
作者姓名:王浩
作者单位:五邑大学数学物理系
摘    要:提出了溅射-气体-聚集共沉积制备金属/金属(介质)复合团簇镶嵌薄膜的新方法,并利用该方法成功地在方华膜衬底上制备了系列Fe/Ag及CaF2复合团簇镶嵌薄膜样品。透射电镜分析结果表明,样品中Fe(Cu)团簇都较好地镶嵌于Ag(CaF2)基质中,其结构为两种材料的多晶共存形态。进一步分析发现,与块材相比,Fe/Ag样品中Fe团簇晶格常数呈现出不同程度的收缩,而Cu/CaF2样品中Cu团簇晶格常数则呈现出不同程度的膨胀。运用附加压力的模型对该现象进行了解释。

关 键 词:溅射-气体-聚集共沉积  镶嵌薄膜  结构

SGA CO DEPOSITION OF METAL/METAL (INSULATOR) CLUSTER EMBEDDED FILM
Wang Hao.SGA CO DEPOSITION OF METAL/METAL (INSULATOR) CLUSTER EMBEDDED FILM[J].Vacuum and Cryogenics,1997,3(2):70-73.
Authors:Wang Hao
Abstract:A novel method as Sputter Gas Aggregation(SGA) co deposition for metal/metal(insulator) cluster embedded film prepartion was produced in this paper,and series of Fe/Ag and Cu/CaF 2 cluster embeded films were prepared on farmvar foil by this method.TEM analysis showed that Fe(Cu) clusters are well encapsulated in Ag(CaF 2) coatings and in multi crystal form in the deposited samples.More detailed analysis showed that compared with that of bulk materials,the lattice constant of Fe clusters was shrinking and that of Cu cluster was expanding in different degree.A simple mode wsa proposed to explain this phenomina.
Keywords:SGA co  deposition  Embedded film  Microstructure  
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