| 集成电路封装用环氧模塑料的绿色阻燃 |
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| 引用本文： | 杨明山,何杰,陈俊. 集成电路封装用环氧模塑料的绿色阻燃[J]. 高分子材料科学与工程, 2008, 24(6): 156-158 |
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| 作者姓名： | 杨明山 何杰 陈俊 |
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| 作者单位： | 北京石油化工学院材料科学与工程系,北京,102617;北京化工大学材料科学与工程学院,北京,100029;北京化工大学材料科学与工程学院,北京,100029;北京石油化工学院材料科学与工程系,北京,102617 |
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| 基金项目： | 国家电子信息产业发展基金 , 北京市自然科学基金 , 新型高分子材料制备与加工北京市重点实验室资助项目 |
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| 摘 要： | 合成了三聚氰胺改性含氮酚醛树脂,以邻甲酚醛环氧树脂为基体树脂,以自制的改性酚醛树脂为固化剂和阻燃剂,对集成电路封装用环氧模塑料绿色阻燃配方及工艺进行了研究。结果表明自制的改性酚醛树脂固化能力好,阻燃效果好。
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| 关 键 词： | 环氧模塑料 绿色阻燃 集成电路封装 |
Green Flame Retardance of Epoxy Molding Compound Used for IC Packaging |
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| YANG Ming-shan,HE Jie,CHEN Jun. Green Flame Retardance of Epoxy Molding Compound Used for IC Packaging[J]. Polymer Materials Science & Engineering, 2008, 24(6): 156-158 |
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| Authors: | YANG Ming-shan HE Jie CHEN Jun |
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| Abstract: | The melamine-phenol formaldehyde novolac resins(MPN,PMPN) were synthesized and can be used for hardener and flame-retardant agent of green EMC.Selecting ortho-cresol novolac epoxy(ECN) as main resin,silica powder as the filler,silane coupling agent as surface treatment,using high-speed pre-mixing and twin roller mixing,the preparation technology of green EMC had been investigated in this paper.The results show that the green EMC which contains MPN and PMPN have better flame retardance. |
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| Keywords: | epoxy molding compound environmental friendly flame retardance IC packaging |
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