Full-Wafer Characterization of AlGaN/GaN HEMTs on Free-Standing CVD Diamond Substrates |
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| Authors: | Chabak K. D. Gillespie J. K. Miller V. Crespo A. Roussos J. Trejo M. Walker D. E. Via G. D. Jessen G. H. Wasserbauer J. Faili F. Babic D. I. Francis D. Ejeckam F. |
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| Affiliation: | Air Force Research Laboratory, Sensors Directorate, Wright-Patterson Air Force Base, Dayton, OH, USA; |
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| Abstract: | We report on electrical characterization and uniformity measurements of the first conventionally processed AlGaN/GaN high electron mobility transistors (HEMTs) on free-standing chemical-vapor-deposited (CVD) diamond substrate wafers. DC and RF device performance is reported on HEMTs fabricated on $sim!!hbox{130-}muhbox{m}$-thick and 30-mm round CVD diamond substrates without mechanical carrying wafers. A measured $f_{T} cdot L_{G}$ product of 12.5 $hbox{GHz} cdot muhbox{m}$ is the best reported data for all GaN-on-diamond technology. X-band power performance of AlGaN/GaN HEMTs on diamond is reported to be 2.08 W/mm and 44.1% power added efficiency. This letter demonstrates the potential for GaN HEMTs to be fabricated on CVD diamond substrates utilizing contact lithography process techniques. Further optimization of the epitaxy and diamond substrate attachment process could provide for improvements in thermal spreading while preserving the electrical properties. |
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