| 低温共烧陶瓷发展进程及研究热点 |
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| 引用本文： | 徐忠华,马莒生,耿志挺,韩振宇,唐祥云.低温共烧陶瓷发展进程及研究热点[J].材料导报,2000,14(4):30-33. |
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| 作者姓名： | 徐忠华 马莒生 耿志挺 韩振宇 唐祥云 |
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| 作者单位： | 清华大学材料科学与工程系,北京,100084 |
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| 基金项目： | 国家自然科学基金资助项目(重点,项目批准号:69836030) |
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| 摘 要： | 低温共烧陶瓷(LTCC)是现代微电子封装中重要的研究分支,主要用于高速、高频系统。介绍了低温共烧陶瓷的发展历程及其中包含的若干重大研究热点,如铜布线工艺、收缩率匹配、LTCC散热等。
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| 关 键 词： | 微电子封装 低温共烧陶瓷 铜布线 收缩率匹配 |
History and Research Focus of Low Temperature Cofired Ceramics |
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| Xu Zhonghua,Ma Jusheng,Geng Zhiting,Hang Zhenyu,Tang Xiangyun.History and Research Focus of Low Temperature Cofired Ceramics[J].Materials Review,2000,14(4):30-33. |
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| Authors: | Xu Zhonghua Ma Jusheng Geng Zhiting Hang Zhenyu Tang Xiangyun |
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| Abstract: | Low temperature cofired ceramics (LTCC) is one of the important research areas in microelectronic package. It's widely used in high frequency systems. This paper reviews the history of LTCC and some research subjects that draw most interest such as copper metallization, match-problem of shrinkage and LTCC heat dissipation are also discussed. |
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| Keywords: | ceramics microelectronic package high frequency |
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