射频MEMS封装技术

MEMS在射频(RF)应用领域表现出的低功耗、低损耗和高数据率的优越特性为RF无线通信系统及其微小型化提供新的技术手段。在产品设计的初期阶段，RF MEMS封装的设计考虑是降低成本、提高产品合格率的有效途径。我们主要针对当前RF MEMS器件与电路设计制造中突出的问题——封装技术进行研究，指出封装在产品设计中的重要地位和技术实现方法，特别介绍了计算机仿真在RF MEMS器件与电路封装中的作用。

RF MEMS Package Technology in Wireless Systems

MEMS technology shows attractive electrical characteristics that are critically needed in the next generation RF wireless systems with low power consumption and high data rate. The researcher should consider the MEMS package at earlier stages in product development, so as to reduce the cost and improve the yield of the products. Aceording to the conflict between elements of RF MEMS and design of package in process, This paper describes the state - of - the-art MEMS package technology for RF applications, and proposes the importance and realization approach to the design of the products. Particularly, computer simulation design concept for RF MEMS elements and circuit package is emphasized.