Electromigration and the electroplastic effect in aluminum SiC MMCs |
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Authors: | Nader G. Dariavach James A. Rice |
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Affiliation: | (1) Marquette University, USA |
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Abstract: | Aluminum SiC metal-matrix composites fabricated by standard powder-metallurgy compaction and sintering were subjected to high-density alternating-current pulses during transverse rupture testing. Results indicate increased strength due to electromigration. Decreases in flow stress were observed during plastic deformation and were attributed to the electroplastic effect. For more information, contact J.A. Rice, Marquette University, 1515 W. Wisconsin Avenue, Milwaukee, Wisconsin 53201-1881; (414) 288-5405 (414) 288-7790 James.Rice@marquette.edu. |
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