| ULSI中金属互连系统上的热点分析 |
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| 引用本文： | 裴颂伟,黄河,何旭曙,鲍苏苏. ULSI中金属互连系统上的热点分析[J]. 微电子学与计算机, 2007, 24(4): 144-147 |
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| 作者姓名： | 裴颂伟 黄河 何旭曙 鲍苏苏 |
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| 作者单位： | 华南师范大学,计算机学院,广东,广州,510631 |
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| 摘 要： | 针对金属互连系统上的热点将对集成电路芯片的性能和可靠性产生重大的影响,详细讨论了ULSI金属互连系统上的热点位置和温度分布模型,并通过该模型比较了不同通孔直径和高度情况下,金属互连系统上的热点位置和温度的差别。结果表明,通孔直径和高度对金属互连系统上的热点有重大的影响。
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| 关 键 词： | 热点 通孔直径 通孔高度 |
| 文章编号： | 1000-7180（2006）04-0144-04 |
| 修稿时间： | 2006-03-29 |
Analysis of Hot Spots in ULSI Interconnect and Via Systems |
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| PEI Song-wei,HUANG He,HE Xu-shu,BAO Su-su. Analysis of Hot Spots in ULSI Interconnect and Via Systems[J]. Microelectronics & Computer, 2007, 24(4): 144-147 |
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| Authors: | PEI Song-wei HUANG He HE Xu-shu BAO Su-su |
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| Affiliation: | School of Computer, South China Normal University, Guangzhou 510631, China |
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| Abstract: | Hot spot is one of the most important factors to the performance and reliability of ULSIo An analytical thermal model for estimating the positions and temperatures of hot spot in interconnect and via systems is presented, and comparing the positions and temperatures of hot spots in different via diameters and via heights in the paper. It has been shown that via diameter and via height have important effects on the hot spot of interconnect and via systems. |
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| Keywords: | hot spot via diameter via height |
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