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2024铝合金化学镀Ni-P加速剂的研究
引用本文:梁平.2024铝合金化学镀Ni-P加速剂的研究[J].电镀与环保,2010,30(1):28-30.
作者姓名:梁平
作者单位:辽宁石油化工大学,机械工程学院,辽宁,抚顺,113001
摘    要:研究了硫脲、碘酸钾以及两者复合后对2024铝合金化学镀Ni-P合金镀层沉积速率的影响。结果表明:硫脲、碘酸钾都可以促进Ni-P合金在铝合金表面的沉积,且当镀液中硫脲、碘酸钾的质量浓度分别为3mg/L和20mg/L时,沉积速率都达到了最大值;并且当两者复合以后,镀层沉积速率又明显提高;当镀液中硫脲和碘酸钾的质量浓度比为1:5时,沉积速率达到最高值,此时镀层质量良好,耐蚀性高。

关 键 词:2  024铝合金  化学镀  加速剂

A Study of the Accelerator for Electroless Plating Ni-P on 2 024 Aluminum Alloy
LIANG Ping.A Study of the Accelerator for Electroless Plating Ni-P on 2 024 Aluminum Alloy[J].Electroplating & Pollution Control,2010,30(1):28-30.
Authors:LIANG Ping
Affiliation:School of Mechanical Engineering;Liaoning Petrochemical University;Fushun 113001;China
Abstract:The effects of thiourea(TU),KIO_3 and their compounds on deposition velocity of Ni-P electroless plating for 2 024 aluminum alloy were studied.The experimental results show that TU and KIO_3 both can accelerate the deposition of Ni-P coating on aluminum alloy,and when the mass concentration of TU and KIO_3 in the bath was 3 mg/L and 20 mg/L respectively,the deposition velocity of both is the highest.Furthermore,the optimal acceleration efficiency can be obtained by compounding TU and KIO_3 at a mass ratio o...
Keywords:2024 aluminum alloy  electroless plating  accelerator  
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