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| Sn-Ag-Cu焊料应用技术 | |
| 引用本文： | 蔡积庆.Sn-Ag-Cu焊料应用技术[J].印制电路信息,2005(3):65-68. |
| 作者姓名： | 蔡积庆 |
| 摘 要： | 概述了NEC的Sn-Ag-Cu焊料的应用技术现状和引起剥离的解决方法。 |
| 关 键 词： | Sn-Ag-Cu焊料 再流焊 流焊 再流焊 流焊复合工艺 剥离 |
Application Technology of Sn-Ag-Cu Solder |
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| Cai Jiqing.Application Technology of Sn-Ag-Cu Solder[J].Printed Circuit Information,2005(3):65-68. | |
| Authors: | Cai Jiqing |
| Abstract: | This paper describes the application technology current status of Sn-Ag-Cu solder in NEC and solution method of bringing about lift off. |
| Keywords: | Sn-Ag-Cu solder reflow soldering flow soldering reflow soldering flow soldering composition process lift off |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |