Effect of Grain Contiguity on the Thermal Diffusivity of Aluminum Nitride |
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Authors: | Masahiko Tajika Hideaki Matsubara William Rafaniello |
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Affiliation: | Synergy Ceramics Laboratory, Fine Ceramics Research Association, Nagoya, Aichi 456–8587, Japan;Dow Chemical Company, Midland, Michigan 48674 |
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Abstract: | Thermal diffusivity of AlN-based ceramics was studied as a function of second-phase amount and heat-treatment time. The Y2O3·Al2O3 contents varied over the range of 13-31 vol%. The thermal diffusivity decreased as the amount of second phase increased. After sintering at 1850°C, the AlN ceramics consisted of rounded, largely isolated grains. Heat treatment of these samples for 5-50 h at 1800°C resulted in microstructures that consisted of largely contiguous AlN grains. There was a substantial increase in the thermal diffusivity after the heat-treatment step, and the incremental improvement was essentially constant for the three compositions that have been studied. The amount of second phase was unchanged during heat treatment; therefore, the increase in thermal diffusivity is assumed to be a direct result of the enhanced contiguity of AlN grains. |
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