| 化学镀技术应用新进展 |
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| 引用本文： | 郭海祥. 化学镀技术应用新进展[J]. 金属热处理, 2001, 0(1): 9-12 |
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| 作者姓名： | 郭海祥 |
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| 作者单位： | 上海市机械制造工艺研究所, |
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| 摘 要： | 化学镀作为表面强化的途径，已引起广泛重视和不断发展。本文综述了化学镀技术在各利常用材料上的应用、合金镀层功能及应用、热处理复合强化、表面再处理等新进展。
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| 关 键 词： | 化学镀 复合强化 合金镀层 表面处理 金属 陶瓷 耐磨性 |
| 文章编号： | 0254－6051（2001）01－0009－04 |
Current Progress of Electroless Plating Technology |
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| GUO Hai-xiang. Current Progress of Electroless Plating Technology[J]. Heat Treatment of Metals, 2001, 0(1): 9-12 |
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| Authors: | GUO Hai-xiang |
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| Abstract: | The electroless plating technology has been progressed constantly and paid more attention to as one of the ways of surface hardening.The progress is dwelt in this paper including the eletroless plating technology application in common materials,the function and application of alloy plating,complex strengthening heat treatment,surface re treatment etc. |
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| Keywords: | electroless plating common material alloy plating complex strengthening |
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