| 低温化学镀锡工艺条件对锡层厚度的影响 |
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| 引用本文： | 孙武,李宁,赵杰,苏晓霞.低温化学镀锡工艺条件对锡层厚度的影响[J].电镀与环保,2006,26(3):17-20. |
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| 作者姓名： | 孙武 李宁 赵杰 苏晓霞 |
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| 作者单位： | 哈尔滨工业大学,应用化学系,黑龙江,哈尔滨,150001;哈尔滨工业大学,应用化学系,黑龙江,哈尔滨,150001;哈尔滨工业大学,应用化学系,黑龙江,哈尔滨,150001;哈尔滨工业大学,应用化学系,黑龙江,哈尔滨,150001 |
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| 摘 要： | 研究了在低温、短时间条件下,化学镀锡液中主盐、配位剂、还原剂、pH值、温度、时间等因素对镀锡层厚度及沉积速率的影响,给出了一个在低温、短时间情况下合理的配方,并研究了镀锡层表面形貌随时间和温度的变化情况.结果表明,随着时间延长,温度上升,镀锡层表面晶粒不断增大,粗糙程度也随之增加.
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| 关 键 词： | 化学镀锡 低温 厚度 表面形貌 |
| 文章编号： | 1000-4742（2006）03-0017-04 |
| 收稿时间： | 2005-11-14 |
| 修稿时间： | 2005年11月14 |
Effects of the Technological Conditions of Low Temperature Electroless Tin Plating on the Thickness of Tin Coating |
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| SUN Wu,LI Ning,ZHAO Jie,SU Xiao-xia.Effects of the Technological Conditions of Low Temperature Electroless Tin Plating on the Thickness of Tin Coating[J].Electroplating & Pollution Control,2006,26(3):17-20. |
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| Authors: | SUN Wu LI Ning ZHAO Jie SU Xiao-xia |
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| Affiliation: | Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China |
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| Abstract: | The effects of main salts,complex,reducer,pH value,temperature,time and other factors in electroless tin plating solution under conditions of low temperature and short time are investigated.A reasonable formula for low temperature and short time process is given.The variation of the surface morphology of the tin coating with time and temperature is also studied.Along with the extending of time and the rising of temperature,surface granules of the tin coating will become bigger and bigger,and the roughness also increase. |
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| Keywords: | electroless tin plating low temperature thickness surface morphology |
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