| 邻苯二甲酸二丙烯酯的固化及其反应动力学 |
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| 引用本文： | 徐莎,梅启林,黄志雄,黎江.邻苯二甲酸二丙烯酯的固化及其反应动力学[J].热固性树脂,2009,24(1). |
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| 作者姓名： | 徐莎 梅启林 黄志雄 黎江 |
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| 作者单位： | 武汉理工大学材料科学与工程学院,湖北,武汉,430070 |
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| 摘 要： | 利用FTIR研究了邻苯二甲酸二烯丙酯(DAOP)在高温条件下的固化反应,采用DSC研究确定了2,3-二甲基-2,3-二苯基丁烷(DMDPB)/邻苯二甲酸二烯丙酯(DAP)体系的固化行为及其动力学参数。结果表明:DMDPB可在180~210℃下引发DAOP树脂的固化反应,且体系固化过程中放热平缓;DMDPB用量为2%时,体系的凝胶温度、固化温度、后处理温度分别为:173.19℃、195.72℃、209.20℃;其表观活化能为93.488 kJ/mol,反应频率因子为1.02×1010,表观反应级数为0.9223。
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| 关 键 词： | 邻苯二甲酸二丙烯酯 固化 动力学参数 |
Curing reaction and its kinetics of diallyl orthophthalate resin |
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| XU Sha,MEI Qi-lin,HUANG Zhi-xiong,LI Jiang.Curing reaction and its kinetics of diallyl orthophthalate resin[J].Thermosetting Resin,2009,24(1). |
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| Authors: | XU Sha MEI Qi-lin HUANG Zhi-xiong LI Jiang |
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| Abstract: | Curing reaction of diallyl orthophthalate(DAOP) resin at high temperature was studied by FTIR.The curing behavior and kinetic parameters of 2,3-dimethyl-2,3-diphenylbutane(DMDPB)/ diallyl orthophthalate(DAOP) curing system were determined by DSC.The results indicated that DAOP resin curing reaction could be initiated at 180-210 ℃ in the presence of DMDPB and the heat release was gentle in the curing process.The gel-temperature,curing temperature and post-curing temperature of the system with 2% DMDPB was 173.19 ℃,195.72 ℃,and 209.20 ℃ respectively.The apparent activation energy was 93.488 kJ/mol.The frequency factor was 1.02×1010 and the reaction order was 0.9223. |
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| Keywords: | diallyl orthophthalate curing reaction kinetic parameter |
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