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线弧参数对铝丝楔焊键合强度的影响研究
引用本文:廖小平,杨兵.线弧参数对铝丝楔焊键合强度的影响研究[J].电子与封装,2013(9):14-17.
作者姓名:廖小平  杨兵
作者单位:无锡中微高科电子有限公司,江苏无锡214035
摘    要:文章主要研究了铝丝楔焊键合过程中线弧参数对键合拉力的影响规律,分析了线弧高度、线弧起始角度、拉弧过程中反向距离与键合拉力之间的关系,实验研究表明线弧高度越大,键合拉力越大;不同线弧起始角度和反向距离对稳定性烘焙试验前键合拉力影响不大,而经过300℃、1 h烘焙后,起始角度太大和反向距离越长,其键合拉力离散性大,并出现小于3 gf的拉力情况,这些实验现象和分析结果为实际生产中键合工艺的优化提供了参考。

关 键 词:楔焊键合  线弧高度  起始角度  反向距离  键合拉力

Study of the Effect of Loop Profile Parameter on Aluminum Wedge Bonding Strength
LIAO Xiaoping,YANG Bing.Study of the Effect of Loop Profile Parameter on Aluminum Wedge Bonding Strength[J].Electronics & Packaging,2013(9):14-17.
Authors:LIAO Xiaoping  YANG Bing
Affiliation:( Wuxi Zhongwei High-tech Electronics Co., Ltd, Wuxi 214035, China)
Abstract:In the Aluminum wedge bonding process, the effect of loop profile parameter on bonding pull is studied. The relationship of loop height, loop starting angle, loop reverse distance and bonding strength are investigated. The experiment research have shown that the greater the loop height, the greater the bond pull. Before the test on the stability baking, different loop starting angle and reverse distance has little effect on the bonding pull, and after 300 ~C, 1 h baking, starting angle is too large and the reverse distance is longer, which result in a large discrete bonding pull, and the phenomenon that bonding pull value is less than 3 gf has occurred. These experiment phenomena and analysis results are useful to bonding process optimization in the production.
Keywords:wedge bonding  loop height  starting angle  reverse distance  bonding pull
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