W-Cu(Mo-Cu)复合材料的研究进展

W-Cu或Mo-Cu两相复合材料具有较高的导热性和较低的热膨胀系数,在大功率器件中被视为一种很好的热沉材料。近年来,有关W-Cu或Mo-Cu作为电子热沉材料的研究在国内外已有一些报道。作者主要就近几年钨铜复合材料研究的几个主要热点问题进行综述报道。分析认为,梯度结构功能材料、纳米结构材料以及注射成形工艺在钨铜复合材料领域中的应用是当今钨铜电子材料发展的主要方向,同时对国内外最新研究进行了归纳总结,指出了今后发展的主要动向。

Developments of Tungsten-Copper (Molybdenum-Copper) composite

Because of the high thermal conductivity and the low coefficient of thermal expansion, the W-Cu (Mo-Cu) composites are widely used as heat sink materials in semiconductivity as well as other fields, The paper concludes all the hot fields concerning the W-Cu composites, The development of the properties and production routes of the materials of W-Cu(Mo-Cu) composites as heat sink materials were reviewed, Three aspects: functionally gradient materials, nan structured materials and PIMed W-Cu composites as well as the industry production routes to whole-produce the materials, are given a overall review.