3-GHz Silicon Photodiodes Integrated in a 0.18-$mu$m CMOS Technology

A new PIN photodiode (PD) structure with deep n-well (DNW) fabricated in an epitaxial substrate complementary metal–oxide–semiconductor (epi-CMOS) process is presented. The DNW buried inside the epitaxial layer intensifies the electric field deep inside the epi-layer significantly, and helps the electrons generated inside the epi-layer to drift faster to the cathode. Therefore, this new structure reduces the carrier transit time and enhances the PD bandwidth. A PD with an area of $70times 70 mu$m $^{2}$ fabricated in a 0.18- $mu$m epi-CMOS achieves 3-dB bandwidth of 3.1 GHz in the small signal and 2.6 GHz in the large signal, both with a 15-V bias voltage and 850-nm optical illumination. The responsivity is measured 0.14 A/W, corresponding to a quantum efficiency of 20%, at low bias. The responsivity increases to 0.4 A/W or 58% quantum efficiency at 16.2-V bias in the avalanche mode.