| 不流动半固化片的研制及应用研究 |
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| 引用本文： | 刘东亮,陈振文,余乃东,杨中强. 不流动半固化片的研制及应用研究[J]. 印制电路信息, 2008, 0(3): 22-24 |
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| 作者姓名： | 刘东亮 陈振文 余乃东 杨中强 |
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| 作者单位： | 广东生益科技股份有限公司,广东,广州,518119 |
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| 摘 要： | 通过对高性能环氧树脂进行降低流动性等特殊改性研究，开发出一种综合性能优良的不流动半固化片（No-Fl0w Prepreg），并成功通过了刚挠结合印制板厂家的试用及一系列严格考察评估。该产品从2007年下半年开始向市场推广，经多个厂家的批量生产使用，结果显示No-Flow Prepreg产品综合性能优良，使用质量稳定，达到国外同类产品的水平。
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| 关 键 词： | 不流动 低流动 半固化片 阶梯板 刚挠性印制板 |
| 文章编号： | 1009-0096(2008)03-0022-03 |
Development and Application of No Flow Prepreg |
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| LIU Dong-liang,CHEN Zhen-wen,SHE Nai-dong,YANG Zhong-qiang. Development and Application of No Flow Prepreg[J]. Printed Circuit Information, 2008, 0(3): 22-24 |
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| Authors: | LIU Dong-liang CHEN Zhen-wen SHE Nai-dong YANG Zhong-qiang |
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| Affiliation: | LIU Dongliang CHEN Zhen-wen SHE Nai-dong YANG Zhong-qiang |
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| Abstract: | Through sophisticated low-flow modification with the applications of epoxy resins, we developed the high performance No-Flow Prepreg, which has passed a series of most stringent evaluation tests conducted by rigidflex PCB customers, This product has been promoted in market since mid 2007, and ever since several customers have used a few quantity of this product to fabricate Rigid-Flex PCB. It turned out that this No-Flow Prepreg has good properties and consistent quality, which attained foreign counterpart＇s level. |
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| Keywords: | no-flow low-flow bonding sheet/prepreg die cavity board rigid-flex PCB |
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