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Material requirements for high voltage, high power IGBT devices |
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| Authors: | R. Zehringer A. Stuck T. Lang |
| Affiliation: | a ABB Corporate Research Ltd., Baden-Dättwil, Switzerland b ABB Semiconductors AG, Fabrikstrasse 3, 5600 Lenzburg, Switzerland |
| Abstract: | The two basic package types of current IGBT modules, which evolved from opposing requirements of traction and power transmission applications, are presented. It is shown that reliability and lifetime aspects given by traction puts most stringent limitations on the choice of materials at given cost targets. The materials used today for high power packaging and the future developments of high power IGBT-packages are discussed. |
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