| 发展高频微波印制板技术分析 |
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| 引用本文： | 黄生荣.发展高频微波印制板技术分析[J].印制电路信息,2008(11):51-55. |
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| 作者姓名： | 黄生荣 |
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| 作者单位： | 惠州中京电子科技有限公司,广东,惠州,516008 |
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| 摘 要： | 文章介绍高频微波印制电路板的各种基板材料特性和生产工艺特性，目的在于让传统PCB制造商了解利用现有资源进入高频微波产品导入方向。
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| 关 键 词： | 高频微波印制板 树脂 |
Technical Analysis for Development of High Frequency & Microwave Printed Circuit Boards |
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| HUANG Sheng-rong.Technical Analysis for Development of High Frequency & Microwave Printed Circuit Boards[J].Printed Circuit Information,2008(11):51-55. |
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| Authors: | HUANG Sheng-rong |
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| Affiliation: | HUANG Sheng-rong |
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| Abstract: | The file introduces the material Capability and producer technological parameter of high ＇frequency ＆ micowave printed circuit boards, expect our factory can use existed equipment develop high frequency ＆ micowave printed circuit boards. |
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| Keywords: | high frequency ＆ micowave printed circuit boards resin |
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