| 基于X射线的焊点图像预处理方法及应用 |
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| 引用本文： | 马吉权,马培军,苏小红. 基于X射线的焊点图像预处理方法及应用[J]. 哈尔滨工业大学学报, 2008, 40(3): 397-400 |
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| 作者姓名： | 马吉权 马培军 苏小红 |
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| 作者单位： | 哈尔滨工业大学计算机科学与技术学院,哈尔滨,150001;黑龙江大学计算机科学与技术学院,哈尔滨,150080;哈尔滨工业大学计算机科学与技术学院,哈尔滨,150001 |
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| 基金项目： | 国防科技应用基础研究基金 |
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| 摘 要： | 为解决焊点隐藏在芯片底部的BGA封装元件的焊点检测问题,研究了基于X射线的焊点质量检测的基本原理,阐述了图像预处理方法的设计与实现.为了提高效率,引入了基于迭代方式的阈值产生技术,实现了焊点的区域分割.最后,讨论了焊点质量判别规则并给出了实验结果,结果表明所设计的图像预处理方法能够很好地满足实际生产中的应用要求.
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| 关 键 词： | BGA 检测 焊点 区域分割 |
| 文章编号： | 0367-6234(2008)03-0397-04 |
| 修稿时间： | 2005-12-08 |
Image preprocessing of solder joints by X-ray |
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| MA Ji-quan,MA Pei-jun,SU Xiao-hong. Image preprocessing of solder joints by X-ray[J]. Journal of Harbin Institute of Technology, 2008, 40(3): 397-400 |
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| Authors: | MA Ji-quan MA Pei-jun SU Xiao-hong |
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| Affiliation: | 1(1.Dept.of Computer Science and Technology,Harbin Institute of Technology,Harbin 150001,China; 2.Dept.of Computer Science and Technology,Heilongjiang University,Harbin 150080,China) |
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| Abstract: | To inspect the array solder joints hidden under IC package in ball grid array(BGA) mounting technology,X-ray was used to obtain the image.This paper discusses the flow and theory of detecting defects based on the X-ray imaging and focuses on the image preprocessing of solder joints.To increase the efficiency,a new method for threshold getting is introduced.And the criterion for the quality of solder joints is discussed.Experimental results reveal that the proposed method is feasible in BGA solder joint inspection. |
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| Keywords: | ball grid array inspection solder joints segmentation |
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