叠轧无氧纯铜制备超细晶材料的EBSD分析

主要对不同条件下叠轧并退火处理的无氧铜试样进行扫描背散射电子衍射(EBSD)分析。EBSD反极图表明，试样内晶粒分布比较均匀，晶体学择优取向不是特别明显，但在局部仍存在微小的取向；EBSD晶粒图分析表明低道次叠轧后材料局部出现细小晶粒和小区域小角度晶界；晶粒度图表明低道次叠轧后大晶粒和小晶粒并存。结果表明利用叠轧法制备超细晶材料可以达到一定的细化目的。

EBSD Analysis on Preparation Ultrafine-Grained Materials with Oxygen-Free Copper by ARB

The Oxygen-free copper after ARB and annealing at different conditions was analyzed by the analysis of electron backscatter diffraction (SEM). The inverse pole figures show that the distribution of grains in the sample is dispersive, the crystallographic preferred orientation is not obvious, and little preferred orientations exist at some place. The analysis of grain mappings shows that ultra-fine grains and small angle grain boundaries appear at some areas after ARB at low rolling times. The grain size chart shows that the small grains and big grains exist in sample at the same time after ARB at low rolling times. It shows that it is feasible to fabricate ultrafine-grained materials using ARB.