| 挠性基板的芯片级封装技术 |
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| 引用本文： | 陈兵.挠性基板的芯片级封装技术[J].印制电路信息,2011(2):57-60. |
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| 作者姓名： | 陈兵 |
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| 作者单位： | 深圳市精诚达电路有限公司,广州,深圳,518104 |
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| 摘 要： | 挠性印制电路(FPC)在IC封装中的应用,推进了电子产品小型化、轻量化、高性能化的进程,同时也推动了FPC向高密度方向发展。本文概述了基于挠性印制电路的芯片级封装技术,包括平面封装和三维封装技术,以及芯片级封装技术的发展对挠性载板的影响。
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| 关 键 词： | 挠性基板 芯片封装 三维封装 |
Chip scale packaging based on flexible printed circuit |
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| CHEN Bing.Chip scale packaging based on flexible printed circuit[J].Printed Circuit Information,2011(2):57-60. |
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| Authors: | CHEN Bing |
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| Abstract: | The application of Flexible printed circuit in the area of IC packaging makes the advanced electronic product miniaturization,lightweight,and high performance,while also promotes the FPC to the high-density circuit.This article outlines the chip scale packaging technology based on flexible printed circuit,including flat packaging and three-dimensional packaging technology,and chip scale packaging technology impact on the flexible substrate. |
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| Keywords: | Flexible Printed Circuit Substrate Chip Scale Packaging 3D Packaging |
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